ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,088, issued on Aug. 19, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China), Avary Holding (Shenzhen) Co. Ltd. (Shenzhen, China) and GARUDA TECHNOLOGY Co. LTD. (New Taipei, Taiwan).
"Circuit board assembly and method for manufacturing the same" was invented by Xin Lu (Huai an, China) and Wei-Xiang Li (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board assembly includes an inner circuit substrate, a first outer circuit substrate, a second outer circuit substrate, a heat conducting block, an electronic component, and a reinforcing plate. The first outer circuit substrate and second outer circui...