ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,378, issued on Dec. 23, was assigned to PURPLE CLOUD DEVELOPMENT PTE. LTD. (Singapore).

"Heat dissipation device and manufacturing method therefor" was invented by Xue Mei Wang (Hui Zhou, China), Xiao Min Zhang (Hui Zhou, China) and Xianyao Liu (Hui Zhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device includes a thermally-conductive base and at least one heat pipe. The thermally-conductive base has a heat absorbing surface, a heat dissipation surface and at least one accommodation hole. The heat dissipation surface faces away from the heat absorbing surface, and the at least one accommodation hole extends from the hea...