US Patent Issued to PULSEFORGE on Jan. 27 for "Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications" (Texas Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,830, issued on Jan. 27, was assigned to PULSEFORGE INC. (Austin, Texas).

"Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications" was invented by Vahid Akhavan Attar (Austin, Texas) and Vikram S. Turkani (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for debonding a wafer from a bonded wafer stack is disclosed. Initially, a light-absorbing layer is placed on a carrier. A wafer is then attached to the light-absorbing layer of the carrier via an adhesive layer to form a bonded wafer stack. After processing the wafer has been processed, a light pulse from a flashlamp is applied to a no...