US Patent Issued to Pukyong National University Industry-University Cooperation Foundation on Sept. 30 for "Method for manufacturing functionally graded composite material for PCB having high heat dissipating properties and electric insulating properties, and functionally graded composite material manufactured thereby" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,573, issued on Sept. 30, was assigned to Pukyong National University Industry-University Cooperation Foundation (Busan, South Korea).

"Method for manufacturing functionally graded composite material for PCB having high heat dissipating properties and electric insulating properties, and functionally graded composite material manufactured thereby" was invented by Hansang Kwon (Busan, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a functionally graded composite material for a printed circuit board (PCB) is proposed. The method may include preparing two or more types of mixed powders with different contents of po...