US Patent Issued to Prevayl Innovations on April 29 for "Sensor package, article comprising the same and manufacturing method thereof" (British Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,736, issued on April 29, was assigned to Prevayl Innovations Ltd. (Wilmslow, Great Britain).

"Sensor package, article comprising the same and manufacturing method thereof" was invented by Michael John Lynch (Manchester, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "The sensor semiconductor package (100) comprises a die pad (101), external connection terminals (103), semiconductor chip 105 and sealing member. The semiconductor chip (105) is located on a top surface of the die pad (101) and is electrically connected with the external connection terminals (103) and the die pad (101). The sealing member covers the die pad (101), the extern...