ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,174, issued on Dec. 16, was assigned to PowerX Semiconductor Corp. (Hsinchu County, Taiwan).
"Power module" was invented by Jing-Yao Chang (Hsinchu County, Taiwan), Tai-Jyun Yu (Hsinchu County, Taiwan) and Sheng-Tsai Wu (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes a substrate, chips, supporting pillars, a metal plate and bonding bodies is disclosed. The substrate includes a metallic layer. The chips are on the metallic layer of the substrate, and each of the chips includes a source, a gate, and a drain. The supporting pillars are on the chips. The metal plate is on the supporting pillars and connecte...