US Patent Issued to Powertech Technology on Nov. 18 for "Fan-out package structure of image sensing device and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,849, issued on Nov. 18, was assigned to Powertech Technology Inc. (Hsinchu, Taiwan).

"Fan-out package structure of image sensing device and manufacturing method thereof" was invented by Ching-Chao Lin (Hukou, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fan-out package structure of an image sensing device includes an image sensing unit having an image sensor with opposite sensing surface and connecting surface, a spacer layer surrounding a central portion of the sensing surface, and a light-transmitting cover plate disposed on the spacer layer spaced apart from and covering the sensing surface. An image signal processor is disposed on the...