US Patent Issued to POWERTECH TECHNOLOGY on Nov. 11 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,833, issued on Nov. 11, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan).

"Package structure and manufacturing method thereof" was invented by Ching-Wei Liao (Hsinchu County, Taiwan) and Shang-Yu Chang Chien (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a manufacturing method thereof are provided. The package structure includes a first package and a second package, and the second package is disposed on the first package. The first package includes a first redistribution layer, at least one chip and a second redistribution layer. The chip is disposed between the first redistribution l...