ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,477, issued on Sept. 23, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).
"Wafer chuck" was invented by Chun-Chi Chou (Hsinchu, Taiwan), Chung-Ming Kuo (Hsinchu County, Taiwan), Bo-An Tsai (Hsinchu, Taiwan) and Shyng-Yeuan Che (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a wafer chuck including a substrate and a heating/cooling wafer. The substrate includes a first surface facing a wafer to be carried and a second surface opposite to the first surface. The heating/cooling wafer is disposed on the first surface of the substrate and includes a plurality of heating...