US Patent Issued to Powerchip Semiconductor Manufacturing on Oct. 7 for "Manufacturing method of semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,037, issued on Oct. 7, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Manufacturing method of semiconductor structure" was invented by Kuo Hsiung Chen (Hsinchu County, Taiwan), Ya-Ting Chen (Hsinchu County, Taiwan), Chun-Ta Chen (Taichung, Taiwan), Chang Tsung Lin (Taichung, Taiwan) and Shih-Ping Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor structure including the following steps is provided. A substrate is provided. A first dielectric layer is formed on the substrate. A first conductive layer is formed in the first dielectric layer. A capping layer is f...