ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,043, issued on Nov. 4, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).
"Wafer processing method" was invented by Chun-Fu Wu (Hsinchu, Taiwan), Shih-Ping Lee (Hsinchu, Taiwan), Yu-Chun Huo (Hsinchu County, Taiwan), Chih Feng Sung (Hsinchu, Taiwan) and Ming-Jui Tsai (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method including following steps is provided. A release layer is formed on a first wafer. An adhesive layer is formed on a second wafer. One of the first wafer and the second wafer is a device wafer. The device wafer includes a valid die region and a trimming region. A handler i...