US Patent Issued to Powerchip Semiconductor Manufacturing on Nov. 11 for "Semiconductor structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,350, issued on Nov. 11, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Semiconductor structure and method of forming the same" was invented by Chia-Hao Chang (Taipei, Taiwan), Jih-Wen Chou (Hsinchu, Taiwan), Hwi-Huang Chen (Hsinchu, Taiwan), Hsin-Hong Chen (Hsinchu, Taiwan) and Yu-Jen Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides a semiconductor structure and a method of forming the same. The semiconductor structure includes a base pattern including a channel region and a drain region, a first semiconductor layer on the channel region of the base pattern, and a gate str...