US Patent Issued to Powerchip Semiconductor Manufacturing on March 25 for "Manufacturing method of semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,149, issued on March 25, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Manufacturing method of semiconductor structure" was invented by Shih-Ping Lee (Hsinchu, Taiwan), Shih-Hsorng Shen (Hsinchu, Taiwan), Chih-Wei Su (Hsinchu, Taiwan) and Yu-Chun Huo (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor structure including the following steps is provided. A first substrate is provided. A first dielectric structure is formed on the first substrate. At least one first cavity is formed in the first dielectric structure. A first stress adjustment layer is forme...