US Patent Issued to Powerchip Semiconductor Manufacturing on June 3 for "Capacitor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,170, issued on June 3, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Capacitor structure and manufacturing method thereof" was invented by Shih-Ping Lee (Hsinchu, Taiwan), Yu-Cheng Lu (Miaoli County, Taiwan), Chia-Hao Yu (Taichung, Taiwan) and Yeh-Yu Chiang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A capacitor structure including a silicon material layer, a support frame layer, and a capacitor is provided. The support frame layer is disposed in the silicon material layer. The support frame layer has recesses. There is a cavity between two adjacent recesses. The support frame layer is located bet...