US Patent Issued to Powerchip Semiconductor Manufacturing on June 24 for "Method of patterning underlying structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,007, issued on June 24, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Method of patterning underlying structure" was invented by Yun-An Chen (New Taipei, Taiwan), Hsiao-Shan Huang (Taichung, Taiwan) and Hsiao-Chiang Lin (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of patterning an underlying structure includes the following. A first patterning process is performed on the underlying structure to form a first patterned underlying structure including a first opening. A patterned photoresist layer is formed, and the patterned photoresist layer fills the first opening. A second patterning p...