US Patent Issued to Powerchip Semiconductor Manufacturing on June 17 for "Back side illumination image sensor and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,313, issued on June 17, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Back side illumination image sensor and method of manufacturing the same" was invented by Chih-Ping Chung (Hsinchu, Taiwan), Saysamone Pittikoun (Hsinchu County, Taiwan), Chih-Hao Peng (Taoyuan, Taiwan) and Ming-Yu Ho (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A back side illumination (BSI) image sensor includes an epitaxial substrate, a deep trench isolation (DTI) structure from one surface to the other surface of the epitaxial substrate, a buried oxide layer on the epitaxial substrate, an epitaxial layer, a well region, a f...