US Patent Issued to Powerchip Semiconductor Manufacturing on June 10 for "Semiconductor package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,777, issued on June 10, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Semiconductor package structure and manufacturing method thereof" was invented by Chun-Lin Lu (Hsinchu, Taiwan), Shou-Zen Chang (Hsinchu, Taiwan) and Chi-Ming Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a control unit and a memory unit. The control unit includes a first wafer and a second wafer that are vertically stacked. The memory unit is disposed on the second wafer of the control unit. The memory unit includes multiple third wafers and a fourth wafer that are stacked vertical...