US Patent Issued to Powerchip Semiconductor Manufacturing on July 8 for "Wafer structure including probe marked test pads" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,921, issued on July 8, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hinschu, Taiwan).

"Wafer structure including probe marked test pads" was invented by Chun-Lin Lu (Hsinchu, Taiwan), Shou-Zen Chang (Hsinchu, Taiwan), Ying-Tsung Chu (Hsinchu, Taiwan) and Ming-Hsun Tsai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer structure and a manufacturing method thereof are provided. The wafer structure includes a substrate structure, a first dielectric layer, multiple test pads, a second dielectric layer, and multiple bond pads. The first dielectric layer is disposed on the substrate structure. The test pads are dispose...