US Patent Issued to Powerchip Semiconductor Manufacturing on July 8 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,961, issued on July 8, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Shih-Ping Lee (Hsinchu, Taiwan) and Mao-Hsing Chiu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure including the following components is provided. A first device structure includes a first substrate, a first dielectric structure, a first landing pad, and a first capping layer. A second device structure is disposed on the first device structure. The second device structure includes a second substrate, a second dielectric structure, a st...