US Patent Issued to Powerchip Semiconductor Manufacturing on July 29 for "Image sensor having a reflective layer overlapping with image sensing element" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,406, issued on July 29, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Image sensor having a reflective layer overlapping with image sensing element" was invented by Chien-Lung Wu (Hsinchu, Taiwan) and Wen-Hao Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides an image sensor integrated chip and a method for forming the same. The image sensor integrated chip includes a substrate including a pixel region, an isolation structure disposed in the substrate and configured at opposite sides of the pixel region, an image sensing element disposed in the pixel region of the substrate...