US Patent Issued to Powerchip Semiconductor Manufacturing on Aug. 19 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,686, issued on Aug. 19, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Shou-Zen Chang (Hsinchu, Taiwan), Chun-Lin Lu (Hsinchu, Taiwan) and Ming-Han Liao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure including a device wafer, a carrier structure, and a redistribution layer (RDL) structure is provided. The device wafer includes a first substrate, a first dielectric layer, first bonding pads, and a power via structure. The carrier structure includes the following components. A second substrate has a thir...