US Patent Issued to Powerchip Semiconductor Manufacturing on April 22 for "Backside illuminated image sensor and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,837, issued on April 22, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Backside illuminated image sensor and manufacturing method thereof" was invented by Jun-Ming Su (Hsinchu, Taiwan), Chih-Ping Chung (Hsinchu, Taiwan) and Ming-Yu Ho (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A backside illuminated image sensor, including a semiconductor layer, a first gate structure, and a light sensing device, is provided. The semiconductor layer has a first surface and a second surface opposite to each other. The first gate structure is disposed on the second surface. The light sensing device is located in t...