ALEXANDRIA, Va., June 17 -- United States Patent no. 12,313,672, issued on May 27, was assigned to Power Technology Solutions LLC (Palo Alto, Calif.).
"System and method of testing for RF-induced electromigration in semiconductor integrated circuits" was invented by Stephen Ludvik (Palo Alto, Calif.) and John McKay (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system and method of using a multi-zone substrate to perform electromigration testing of integrated circuits in the high-frequency RF domain. Here, the device under test (DUT) is affixed to a single, multi-zone substrate with a high-temperature zone, a transitional thermal isolation zone, to a low-temperature zone. The high-temp...