US Patent Issued to POLYMERIC CONVERTING on May 27 for "Cut and stack pressure sensitive adhesive substrates and process" (Connecticut Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,312,122, issued on May 27, was assigned to POLYMERIC CONVERTING LLC (Enfield, Conn.).

"Cut and stack pressure sensitive adhesive substrates and process" was invented by Peter J. Dronzek Jr. (New Milford, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A process of producing printed variably imaged labels cut to individual label sheets in a pre-defined sequence of variable information synchronized with the planogram of a retail store for labeling, output from a factory assembly line for unique product labeling or labeling of shipments from a fulfillment or distribution warehouse that all have unique data and follow a planogram or planned sequence. T...