ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,748, issued on Aug. 19, was assigned to PLESSEY SEMICONDUCTORS Ltd. (Plymouth, Great Britain).
"Substrate bonding" was invented by Kevin Stribley (Plymouth, Great Britain), Reetta Griffiths (Plymouth, Great Britain), Ian Murray (Plymouth, Great Britain), Stuart Brodie (Plymouth, Great Britain) and Sharon Farrens (Plymouth, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of preparing a substrate for substrate bonding is provided. The method comprises: forming a recess in a substrate surface of the substrate, and forming a bondable dielectric layer on the substrate surface of the substrate. The bondable dielectric layer has a bon...