US Patent Issued to PLANTIC TECHNOLOGIES on April 22 for "Multilayer structure, method of producing the same, and packaging container" (Japanese, Australian Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,280,584, issued on April 22, was assigned to PLANTIC TECHNOLOGIES LTD (Altona, Australia).

"Multilayer structure, method of producing the same, and packaging container" was invented by Akihiro Kotaka (Kurashiki, Japan), Masahiko Ota (Kurashiki, Japan) and Nicholas John McCaffrey (Altona, Australia).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a multilayer structure including a starch layer (A), an adhesive layer (B), and a base material layer (C) in the order mentioned. In this multilayer structure, a material constituting the starch layer (A) comprises a starch and water; a material constituting the adhesive layer (B) c...