US Patent Issued to Plansee Shanghai High Performance Material, Plansee, Plansee Japan on Dec. 2 for "Sputtering target" (Austrian, Chinese, Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,563, issued on Dec. 2, was assigned to Plansee Shanghai High Performance Material Ltd. (Shanghai), Plansee SE (Reutte, Austria) and Plansee Japan Ltd. (Yokohama, Japan).

"Sputtering target" was invented by Chao Chen (Shanghai), Jiandong Lu (Shanghai), Christian Linke (Reutte, Austria), Tsutomu Kuniya (Kanagawa, Japan) and Hennrik Schmidt (Reutte, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sputtering target includes a tubular backing tube which has an axis which is defined as an axial direction, and a plane in which a radial direction lies is perpendicular to the axial direction. A cylindrical target segment is arranged on the tubular ba...