ALEXANDRIA, Va., June 4 -- United States Patent no. 12,318,858, issued on June 3, was assigned to PINK GMBH THERMOSYSTEME (Wertheim, Germany).
"Diffusion soldering and/or sintering device, die and system, for connecting components of at least one electronic assembly" was invented by Christoph Oetzel (Freudenberg Boxtal, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to a diffusion soldering device and/or sintering device, to a press tool and to a system comprising these for connecting components of at least one electronic assembly, in particular of a plurality of electronic assemblies, by means of diffusion soldering or pressure sintering. The device comprises an upper tool and ...