ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,523, issued on May 13, was assigned to Picosun Oy (Espoo, Finland).
"Substrate processing apparatus and method" was invented by Vaino Kilpi (Masala, Finland).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes an inner chamber formed by an upper portion and a lower portion, a substrate support to support a substrate within the upper portion of the inner chamber, a plasma system to provide the inner chamber with plasma species from the top side of the inner chamber, and an outer chamber surrounding the upper portion of the inner chamber. The lower portion of the inner chamber extends to the outside of the outer cha...