ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,465,831, issued on Nov. 11, was assigned to Piana Nonwovens LLC (Cartersville, Ga.).
"Systems and methods for mobile molding and bonding" was invented by Andrea Piana (Atlanta), Michael Stephen DeFranks (Atlanta), Eric McCann (Kennesaw, Ga.), Andy Hollis (White, Ga.), Sang-Hoon Lim (Smyrna, Ga.) and Mehran Jafari (Kennesaw, Ga.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A mobile molding system, comprising a vehicle and one or more molds arranged on the vehicle configured for receiving one or more expandable nonwoven substrates, heating said one or more expandable nonwoven substrates so as to cause said one or more expandable nonwoven substrates to e...