US Patent Issued to PI ADVANCED MATERIALS on Nov. 25 for "Polyamic acid composition, method for preparing polyamic acid composition, polyimide comprising the same and coating material comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,959, issued on Nov. 25, was assigned to PI ADVANCED MATERIALS Co. LTD. (Chungcheongbuk-do, South Korea).

"Polyamic acid composition, method for preparing polyamic acid composition, polyimide comprising the same and coating material comprising the same" was invented by In Hwan Hwang (Seoul, South Korea), Gyeong Hyeon Ro (Gyeongsangnam-do, South Korea) and Ik Sang Lee (Gyeongsangbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application relates to a polyamic acid composition, a method for preparing the polyamic acid composition, a polyimide comprising the same, and a coating material comprising the same, which provides ...