US Patent Issued to PI Advanced Materials on March 25 for "Polyimide film, method for producing same, and flexible metal foil clad laminate comprising same" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,447, issued on March 25, was assigned to PI Advanced Materials Co. Ltd. (Jincheon-gun, South Korea).

"Polyimide film, method for producing same, and flexible metal foil clad laminate comprising same" was invented by Dong Young Won (Chungcheongbuk, South Korea) and Dong Young Kim (Chungcheongbuk, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polyimide film, a method of manufacturing the same, and a flexible metal foil clad laminate including the same. The polyimide film includes: a first imide bond unit having a glass transition temperature of 400deg C. or higher; and a second imide bond unit having a glass transition temperature of l...