US Patent Issued to PI Advanced Materials on Dec. 16 for "Low-dialectric polyimide film and method for producing same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,487, issued on Dec. 16, was assigned to PI Advanced Materials Co. Ltd. (Chungcheongbuk-do, South Korea).

"Low-dialectric polyimide film and method for producing same" was invented by Sung-Yul Back (Chungcheongbuk-do, South Korea) and Kil-Nam Lee (Chungcheongbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is provided a method for manufacturing a polyimide film, the method comprising the steps of: preparing a polyamic acid solution; preparing a polyamic add composition by adding 2-3 mole equivalents of a dehydrating agent to the polyamic acid solution; and applying the polyamic acid to a support to form a film, foll...