US Patent Issued to PI Advanced Materials on Dec. 16 for "Highly adhesive and low-dialectric polyimide film and method for producing same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,488, issued on Dec. 16, was assigned to PI Advanced Materials Co. Ltd. (Chungcheongbuk-do, South Korea).

"Highly adhesive and low-dialectric polyimide film and method for producing same" was invented by Sung-Yul Back (Chungcheongbuk-do, South Korea) and Kil-Nam Lee (Chungcheongbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided herein is a method for manufacturing a polyimide film, the method including the steps of: preparing a polyamic acid solution; preparing a polyamic acid composition by adding a dehydrating agent and an imidizing catalyst to the polyamic acid solution; and applying the polyamic acid to a support to form ...