US Patent Issued to Phoenix Pioneer Technology on July 1 for "Semiconductor package antenna structure and its manufacturing method" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,919, issued on July 1, was assigned to Phoenix Pioneer Technology Co. Ltd. (Hsinchu County, Taiwan).

"Semiconductor package antenna structure and its manufacturing method" was invented by Che-Wei Hsu (Hsinchu County, Taiwan) and Shih-Ping Hsu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention discloses a semiconductor package antenna structure and its manufacturing method, wherein the semiconductor package antenna structure includes a first substrate, a semiconductor chip, and a second substrate. The first substrate has at least two stacked first redistribution layers, and each of the first redistribution layers has ...