US Patent Issued to PHOENIX PIONEER TECHNOLOGY on April 8 for "Semiconductor packaging substrate and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,653, issued on April 8, was assigned to PHOENIX PIONEER TECHNOLOGY Co. LTD. (Hsinchu County, Taiwan).

"Semiconductor packaging substrate and manufacturing method thereof" was invented by Chao-Tsung Tseng (Hsinchu County, Taiwan) and Che-Wei Hsu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor packaging substrate is provided, which includes a build-up circuit structure, at least one fiducial marker structure, and an insulating protective layer. The fiducial marker structure includes a fiducial marker and a second insulating layer covering the fiducial marker. The second insulating layer is made of a transparent i...