US Patent Issued to PHISON ELECTRONICS on Dec. 9 for "Multi-layer circuit board structure and memory storage device" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,506, issued on Dec. 9, was assigned to PHISON ELECTRONICS CORP. (Miaoli, Taiwan).

"Multi-layer circuit board structure and memory storage device" was invented by Chun Ming Huang (Yunlin County, Taiwan) and Yong Lin Chen (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-layer circuit board structure and a memory storage device are disclosed. The multi-layer circuit board structure includes a first capacity component, a second capacity component, a first conductor, and a first via hole. The first via hole is connected to the first conductor. At a first layer of the multi-layer circuit board structure, a first capacity component...