US Patent Issued to Peking University on July 22 for "Multi-layer wave absorber structure and use thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,290, issued on July 22, was assigned to Peking University (Beijing).

"Multi-layer wave absorber structure and use thereof" was invented by Jinbo Yang (Beijing), Zhou Liu (Beijing), Wenyun Yang (Beijing), Jingzhi Han (Beijing), Changsheng Wang (Beijing) and Shunquan Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to the technical field of microwave absorption, and in particular, to a multi-layer wave absorber structure and use thereof. The multi-layer wave absorber structure has a sandwich structure, and an intermediate layer of the sandwich structure is an electromagnetic loss-free dielectric layer. The ele...