US Patent Issued to PARLEX (SHANGHAI) ELECTRONICS on June 17 for "Card substrate for carrying chip module and smart card thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,101, issued on June 17, was assigned to PARLEX (SHANGHAI) ELECTRONICS Co. LTD. (Shanghai).

"Card substrate for carrying chip module and smart card thereof" was invented by Ngai Man Poon (Hong Kong), Rong Zhang (Shanghai) and Yiqi Zhang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a card substrate for carrying a chip module, the card substrate has a first surface and a second surface opposite to the first surface, and a concave portion for accommodating the chip module, the concave portion includes a first concave portion, and a second concave portion further recessed from a bottom wall of the first concave portion,...