US Patent Issued to Parabellum Strategic Opportunties Fund on Oct. 14 for "Vias for cobalt-based interconnects and methods of fabrication thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,649, issued on Oct. 14, was assigned to Parabellum Strategic Opportunties Fund LLC (Austin, Texas).

"Vias for cobalt-based interconnects and methods of fabrication thereof" was invented by Yu-Jen Chang (Hsinchu, Taiwan), Hua Feng Chen (Hsinchu, Taiwan), Kuo-Hua Pan (Hsinchu, Taiwan) and Min-Yann Hsieh (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Interconnect structures and corresponding techniques for forming the interconnect structures are disclosed herein. An exemplary interconnect structure includes a conductive feature that includes cobalt and a via disposed over the conductive feature. The via includes a first via barrier l...