US Patent Issued to Parabellum Strategic Opportunities Fund on Dec. 9 for "Multi-die package structures including an interconnected package component disposed in a substrate cavity" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,455, issued on Dec. 9, was assigned to Parabellum Strategic Opportunities Fund LLC (Austin, Texas).

"Multi-die package structures including an interconnected package component disposed in a substrate cavity" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Kuo-Chung Yee (Taoyuan, Taiwan), Tsung-Ding Wang (Tainan, Taiwan) and Chien-Hsun Lee (Chu-Tung Town, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a method of making the same are provided. A first die and a second die are placed over a carrier substrate. A first molding material is formed adjacent to the first die and the second die. A first redistribution layer is ...