US Patent Issued to PANJIT INTERNATIONAL on Feb. 11 for "Packaged component with composite pin structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,224,228, issued on Feb. 11, was assigned to PANJIT INTERNATIONAL INC. (Kaohsiung, Taiwan).

"Packaged component with composite pin structure and manufacturing method thereof" was invented by Yung-Hui Wang (Kaohsiung, Taiwan), Chung-Hsiung Ho (Kaohsiung, Taiwan) and Chi-Hsueh Li (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a packaged component with a composite pin structure has: dividing a substrate into a body area and a pin area, wherein a chip is arranged on the body area of the substrate and is electrically connected to conductive layers on the opposite surfaces of the substrate. The pin area is pre-defined...