US Patent Issued to PANJIT INTERNATIONAL on April 29 for "Thin semiconductor packaging unit having a plurality of bridging layers" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,737, issued on April 29, was assigned to PANJIT INTERNATIONAL INC. (Kaohsiung, Taiwan).

"Thin semiconductor packaging unit having a plurality of bridging layers" was invented by Chung-Hsiung Ho (Kaohsiung, Taiwan) and Chi-Hsueh Li (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thin semiconductor packaging unit includes a semiconductor die, a mold, two contact bulks, a first bridge layer, a second bride layer, and two insulation layers; the mold covers a side surface of the semiconductor die; the mold includes two sides, and each of the sides includes at least one first contact area; the two contact bulks are respectively mounted on ...