US Patent Issued to PANELSEMI on April 15 for "Substrate structure with high density layout and electronic device using the same" (Taiwanese Inventor)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,314, issued on April 15, was assigned to PANELSEMI Corp. (New Taipei, Taiwan).

"Substrate structure with high density layout and electronic device using the same" was invented by Chin-Tang Li (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate structure includes a carrier board and a laminated structure. The carrier board has a board body, through holes and conductive portions. The board body has a first surface and a second surface. The through holes communicate the first and second surfaces. Each through hole has a first opening and a second opening. The conductive portions are arranged on the first surface, and the first ope...