ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,051, issued on Oct. 7, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Dicing system and dicing method" was invented by Hiroshi Benno (Osaka, Japan) and Koji Tamura (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a dicing system including a protection layer forming apparatus, a patterning apparatus, a plasma treatment apparatus, a measuring apparatus that obtains at least of first processing data relating to a protection layer, second processing data relating to a mask, and third processing data relating to element chips, and a control unit that operates at least one of the protection lay...