US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Nov. 25 for "Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,157, issued on Nov. 25, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate" was invented by Yuki Yoshioka (Fukuoka, Japan), Tadahiko Sakai (Fukuoka, Japan), Tadashi Maeda (Fukuoka, Japan) and Shingo Okamura (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. ...