US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Nov. 18 for "Tungsten wire and saw wire" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,614, issued on Nov. 18, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Tungsten wire and saw wire" was invented by Tomohiro Kanazawa (Osaka, Japan), Yoshihiro Iguchi (Osaka, Japan), Naoki Kohyama (Osaka, Japan), Atsushi Shimada (Osaka, Japan), Kenshi Tsuji (Osaka, Japan) and Yui Nakai (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A tungsten wire contains tungsten or a tungsten alloy. An average width of surface crystal grains in a direction perpendicular to an axis of the tungsten wire is at most 76 nm. The tungsten wire has a tensile of at least 4800 MPa, and a diameter of at most 100 micro metre...