US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Nov. 18 for "Method for manufacturing stretchable circuit board, metal-clad laminated sheet, metal foil with resin, stretchable circuit board, and stretchable circuit mounted article" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,651, issued on Nov. 18, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Method for manufacturing stretchable circuit board, metal-clad laminated sheet, metal foil with resin, stretchable circuit board, and stretchable circuit mounted article" was invented by Tomohiro Fukao (Osaka, Japan), Tomoaki Sawada (Osaka, Japan), Kyosuke Michigami (Hyogo, Japan) and Qianying Li (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a pee...