US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on May 13 for "Element chip manufacturing method and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,482, issued on May 13, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Element chip manufacturing method and substrate processing method" was invented by Hidehiko Karasaki (Hyogo, Japan) and Shogo Okita (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method including: a step of preparing a substrate that includes a first layer having a first principal surface provided with a dicing region, and a mark, and a second principal surface, and includes a semiconductor layer; a step of covering a first region corresponding to the mark on the second principal surface, with a resist film; a step of forming a...