US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on July 29 for "Thermally conductive silicone composition and thermally conductive silicone material" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,568, issued on July 29, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Thermally conductive silicone composition and thermally conductive silicone material" was invented by Keiichi Komatsu (Osaka, Japan) and Hiroshi Yamamoto (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermally conductive silicone composition contains a silicone component and a polyhedral filler."

The patent was filed on Aug. 20, 2020, under Application No. 17/640,157.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetaht...